Signal integrity: reliable performance at high data speeds
Technolution combines in-depth knowledge of high-speed electronics with practical design strategies to enable faultless data transport at high speed. Simulations and measurements ensure our solutions are robust and compliant with the strictest technical requirements. This is how we help organizations meet the growing demand for high, reliable bandwidth.
The challenge of electrical signal transmission
The digital world processes immense data volumes. Cloud applications, AI datacenters, and scientific and industrial equipment need ever greater bandwidth. Light is the ideal vehicle for transferring data across long distances, but on circuit boards and in chip packaging, data transport takes the form of an electrical signal across copper tracks, connectors, and in electronic components. Right there is where the challenges lie. The main challenge is signal integrity: how do you keep signals pure and reliable at data speeds that can reach terabits per second?
Complexity at high frequencies
At high data speeds and frequencies, electrical signals start to behave like electromagnetic waves. On electronic components, bends in tracks, switchovers between layers, connectors, or even small variations in the material can lead to reflections, crosstalk, and loss. The chips also have to be fitted with supply voltage which remains stable even at high frequencies: power integrity.
The successive bits disrupt each other, causing loss of signal integrity and making it more difficult to distinguish the digital signal correctly. Equalizers on the chips can compensate for this, but that does require energy (and therefore heat) and can exacerbate crosstalk. In addition, all choices affect the electromagnetic compatibility (EMC) and project costs. A robust design of the electronics thus simultaneously respects signal integrity, power integrity, EMC, heat management, and the project context.
Experience with high-speed electronics and signal integrity
Technolution has many years’ experience designing high-speed electronics with high signal integrity. We use tools such as Keysight ADS, SIPro, and PIPro for pre- and post-layout simulation. High-grade equipment, such as the Keysight 44 GHz Vector Network Analyzer and the PacketMicro probe station help characterize the print material and the print production process and help verify prototypes. Our specialists combine in-depth knowledge of electromagnetism, PCB layout, and system architecture with practical design strategies. We have a wide range of EMC pre-compliance devices that we use to solve the most important problems even before time-consuming compliance testing.
Case: Reflecting on IC packaging
Amsterdam Scientific Instruments (ASI) manufactures camera systems with sensor chips that use Through Silicon Vias (TSVs). The layout of the transition to a Ball Grid Array (BGA) is critical with respect to signal integrity, power integrity, and heat management.
We now have the certainty that we were always looking for. Working with Technolution was an efficient process: the first results were obvious very soon. We iteratively simulated anything else that seemed relevant.
From concept to implementation
Our services in the field of high-speed electronics and signal integrity encompass the whole trajectory: from concept studies and simulations to prototype development, testing, and implementation in production. In doing so, we use advanced simulation and measurement equipment to predict and verify signal behavior. This helps us realize cost-effective solutions that meet both the technical requirements and the budgetary preconditions.
When developing new network standards, designing embedded systems, or realizing innovative solutions for industry and science, we make sure that the electronic basis is reliable and future-proof. And in doing so, signal integrity is an indispensable key to success.
